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RF and Microwave Microelectronics Packaging II

Name: RF and Microwave Microelectronics Packaging II
Brand: Springer International Publishing AG
SKU: 19737758
Price: 106.85 EUR
Availability: InStock
Author: KEN KUANG
ISBN: 9783319847191

KEN KUANG

Língua

Inglês

Livro Capa mole

Código Libristo: 19737758

Editoras Springer International Publishing AG, junho 2018

This book presents the latest developments in packaging for high-frequency electronics. It is a comp... Descrição completa

Código Libristo: 19737758

259 b

106.85 €

Armazenamento externo Envio em 10-18 dias

Até 30 dias para devoluções

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This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.