Contacto
Como comprar
Entrega
Guia de compras
Inglês
193 b
Até 30 dias para devoluções
Os clientes também compraram
/
Capa mole
47.61
€
/
Capa mole
38.10
€
/
Capa mole
14.95
€
/
Calendário
30.92
€
/
Capa mole
52.56
€
With the decrease in feature size of CMOS integrated §circuits, interconnect design has become an §important issue in high speed, high complexity §integrated circuits. Different design methodologies §have been proposed to improve circuit performance. §Wire sizing, driver sizing, repeater insertion, and §wire shaping are common techniques to enhance §circuit performance.§ With increasing signal frequencies and the §corresponding decrease in signal transition times, §the interconnect impedance can behave inductively. §Line inductance introduces new tradeoffs in §interconnect design and driver sizing to decrease §the circuit delay. Different design methodologies §under an inductive environment are described in this §book. Including line inductance in the design §process can enhance both the delay and power as well §as improve the accuracy of the overall design §process. By including the on-chip inductance, the §efficiency of different circuit design techniques §such as wire sizing, driver sizing, repeater §insertion, and line tapering can be greatly §enhanced.
Sobre o livro
Inglês
Ofereça este livro hoje
É fácil
1 Adicione ao carrinho e escolha Entregar como presente ao finalizar a compra 2 Receberá um vale 3 O livro chegará ao endereço do destinatárioTambém pode estar interessado em
/
Livro de capa dura
234.83
€
/
Capa mole
20.31
€
/
Capa mole
22.03
€
/
Livro de capa dura
31.63
€
/
Capa mole
16.47
€
/
Capa mole
48.11
€
Olá! Sou o Libroamiko, o seu conselheiro de livros.
Como posso ajudar?