Não gostou? Não há problema! Pode devolver os artigos até 30 dias
Não há como errar com um vale de oferta. O presenteado pode escolher qualquer produto da nossa oferta.
Até 30 dias para devoluções
Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured. Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation (STI), copper damascene, and novel devices and CMP integration.
Olá! Sou o Libroamiko, o seu conselheiro de livros.
Como posso ajudar?